PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access rules or Assembly Design Kit (ADK). transceiver was designed have Tx Rx elements single photonic chip, together with flipchip control electronics, hybrid laser micro-optics. on-chip micro-optics enable pluggable fiber connection, avoiding need bond fibers directly chip. Finally, packaged module tested, showing 56 Gb/s loop-back modulation de-modulation, validating both transmitter receiver performance.